3D-IC STCO SOC Design Architect
Posted on: March 15, 2023
The future of Moore's Law: 3D-IC
Intel Teases Falcon Shores Supercomputer Processor: CPU and GPU in One Socket - Tom's Hardware (tomshardware.com) (https://www.tomshardware.com/news/intel-teases-falcon-shores-xpu)
The Design Technology Pathfinding (DTP) organization in Design Enabling (DE) is chartered to identify and drive key strategic initiatives in the pathfinding of future technologies, as a holistic Design co-optimization across the Product stack from System architecture to silicon as we extend DTCO to STCO (System Technology Co-Optimization). The job requires partnering and leveraging domain experts across Intel and the EDA Eco-System.
Responsibilities include, but are not limited to the following:
Architecture definition to establish STCO (System Technology Co-Optimization) 3DIC prototypes across market segments. Identify 3D architecture configurations and die partition for best System Co-optimization PPAC.
Micro architecture, IP configuration, RTL coding, Verilog system simulation, validation and timing analysis.
Test Chips validation of 3DIC technology and methodology. Silicon debug.
Design optimization of 3D advanced silicon and package technology features to enable strong product differentiation.
Collaboration with the different Product teams to identify critical product characteristics and target setting requirements.
Development of Physical Design 3DIC construction and validation methodology and EDA capabilities.
The candidate should also exhibit the following behavioral traits and/or skills:
Excellent analytical and problem-solving skills.
Strong verbal/written communication skills.
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Master's degree in Electrical or Computer Engineering with 15+ years of experience in the following areas:
Micro-architecture trade-offs and Logic design using System Verilog.
Design for Test (DFT) and Design for Debug (DFD), ATPG, MBIST, etc.
Pre-silicon and post-silicon validation.
Simulation and debug experience using VCS/Verdi.
Multiple clock domain design.
Low-power design using UPF and clock gating.
Synthesis and speed path debug.
Scripting skills using a programming language such as Python, TCL.
Experience with ARM-based Systems.
3D Silicon and 3D packaging technologies.
Design Methodologies for optimal Performance Power Area Cost (PPAC) in advanced technologies.
Physical Design EDA tools, design reference/sign-off flows and EDA vendor engagement.
Circuit design and silicon technology.
Inside this Business Group
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth.
Intel strongly encourages employees to be vaccinated against COVID-19. Intel aligns to federal, state, and local laws and as a contractor to the U.S. Government is subject to government mandates that may be issued. Intel policies for COVID-19 including guidance about testing and vaccination are subject to change over time.
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here: https://www.intel.com/content/www/us/en/jobs/benefits.html
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. In certain circumstances the work model may change to accommodate business needs.
Keywords: Intel, Jackson , 3D-IC STCO SOC Design Architect, Professions , Jackson, Mississippi
here to apply!